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实验室简介

时间:2019-01-16

半导体集成技术工程研究中心

——科技基础条件平台

根据国家、中国科学院和半导体所的发展战略需要,2002年开始筹建综合性半导体工艺技术加工平台——半导体集成技术工程研究中心(以下简称中心)。中心拥有配套齐全的先进工艺平台、1700平米的超净工艺线和1100平米的办公用房,于2004年12月完成并投入使用。中心建立了规范的人员、服务和设备管理体系,具备了微纳电子学、光电子学以及微电子机械器件的集成加工及测试表征能力,对研究所科研目标的凝练、国家级重大和重点项目的申请和完成、科技企业的关键工艺研发、人才培养和交流起到了关键的支撑作用。

中心具有的关键工艺和测试设备:电子束光刻设备、MA6/BA6双面光刻机和EVG光刻机;分别用于硅、氧化硅、金属和III-V族半导体材料刻蚀的感应耦合等离子体(ICP)刻蚀设备;电子束金属蒸发设备、离子束溅射镀膜设备、磁控溅射设备、等离子增强化学气相淀积系统(PECVD)、低压增强化学气相淀积系统(LPCVD);离子注入系统、氧化及合金设备、晶片键合设备;光波导器件自动对准耦合测试系统、分光光度计、台阶仪、低温微波探针台、网络分析仪、半导体参数测试仪、MEMS可靠性及频谱特性测试设备、太阳能电池测试仪器等。

中心是一个完全开放的科技基础条件平台,是首批加入中国科学院所级公共技术服务中心的成员;不仅为所内外科研人员提供技术和设备咨询服务,还进行单项和集成工艺技术服务以及科研项目合作研究。此外,还加入以下公共技术服务联合平台:北京物质和纳米科学大型仪器区域中心、中国科学院知识创新工程基地纳米器件平台、首都科技条件平台中国科学院研发实验服务基地、中关村开放实验室等院级以及国家级公共技术服务平台,为国内相关科研人员提供了有力的设备和技术支撑。主要设备仪器的利用率达到80%以上,共享率达到50%以上。

2006年8月28日路甬祥院长视察半导体所时指出:“半导体所的优势是在光电子与微电子的结合,要进一步提升自主创新能力和集成技术水平,努力加强科技平台建设。半导体所完成了半导体集成技术工程中心的建设,经过两年的发展该中心已具备了欧洲同类研究中心的中上水平,设备完备程度和基本的环境不错,而且主要靠研究所自己的经费建成,形成了较强的竞争优势,提升了核心竞争力,为三期创新奠定了较好的基础。下一步中心平台要向全院、全国开放,为国家的科技创新作出更大贡献。中心平台的建成也说明半导体所的领导班子有较强的判断力和前瞻意识,有比较强的统筹决策能力,也说明半导体所全体同志对领导班子正确决策积极地给予支持。”

半导体集成技术工程研究中心的主要任务:不断提高半导体工艺技术的水平和能力,满足研究所发展的科学技术需求;重点开发国家重大战略需求和国民经济发展需求的关键信息技术,促进研究所的快速发展;重点攻克具有潜在市场价值科研成果的关键和可靠性技术,促进成果的快速转化;面向所内外开放,建成国际一流的人才培养、研发及合作交流中心。

Engineering Research Center for Semiconductor Integrated Technology

The Engineering Research Center for Semiconductor Integrated Technology is an advanced technology platform for optoelectronics, microelectronics and MEMS. It was planned to be constructed by the Institute of Semiconductors in 2002 for the strategic development of the institute, Chinese Academy of Sciences and Chinese government. All the advanced equipments are over 100 million RMB for semiconductor key processes and measurements. The working area is 1,700 m2 for the clean rooms and 1,100 m2 for the office and test rooms. With the perfection of the standard service and management, the center has become the critical technical support department for research works and enterprises, student training and technique exchange.

Main process equipments in the center include e-beam lithography system, MA6/BA6 double-side mask aligner and EVG mask aligner, induced coupling plasma (ICP) etching system for Si, SiO2, metal and III-V semiconductors, e-gun evaporator, ion beam sputter, magnetron sputter, plasma enhanced chemical vapor deposition (PECVD) system, low-pressure chemical vapor deposition (LPCVD), ion implantation system, thermal oxidation system, metallization system and wafer bonding system. Main measurement equipments include multi-channel fiber/waveguide coupling test system, spectrophotometer, surface profiler, low temperature probe station, network analyzer, semiconductor parameter analyzer, MEMS stability and spectrum testing system, solar simulator and solar cell tester.

The center is an open platform, offering not only technical services and project cooperation, but also consulting service of technology for researchers. In order to provide technical supports and equipments effectively, the center has joined many technology platforms of public services, such as Technology Joint Platform of Institutes in Chinese Academy of Sciences, Nano-apparatus Platform of Knowledge Innovation Engineering Base in Chinese Academy of Sciences, Beijing Nano-science Valued Apparatuses Area Center, Capital Science and Technology Platform and National Public Technology Service Platform. The utility ratio of main equipments is above 80%, and the share ratio is above 50%.

Prof. Yongxiang LU, president of the Chinese Academy of Sciences, visited the Institute of Semiconductors, CAS on August 28, 2006. He said: “The advantage of the Institute of Semiconductors is the combination of optoelectronics and microelectronics. The institute should further improve the ability of independent innovation and integrated technology, pushing on the construction of the technical platform. Engineering Research Center for Semiconductor Integrated Technology, constructed by own funds two years ago, has equaled to the above-middle level of the European technical centers. Both equipments and the working environment are so good that the strong core competition advantage has been formed for the third period innovation plan. Next, the platform would contribute to national scientific and technological innovation, being open to other institutes. The establishment of the center shows that the leader group has strong judgment ability, prospective idea and decision-making ability. It also shows the strong supports of all employees to the wise policy decision of leader group.”

The aim of the center is to continually improve the level and the ability of semiconductor technology to satisfy the scientific need of the institute; to develop the information technology to meet national great strategy and economic development; to make breakthrough in the pivotal and reliable technology to accelerate the transfer of research achievements; and to be open to the outside as a top technical center for student training, academic cooperation and communication.


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